Ọla kọpabụ ihe dị mkpa n'ichepụta bọọdụ sekit n'ihi na ọ nwere ọtụtụ ọrụ dị ka njikọ, conductivity, dissipation okpomọkụ, na mkpuchi electromagnetic. Mkpa ya pụtara onwe ya. Taa ka m ga-akọwara gị maka yampịakọta ọla kọpa(RA) na ọdịiche dị n'etitifoil ọla kọpa electrolytic(ED) na nhazi nke foil ọla kọpa PCB.
PCB ọla kọpa foilbụ ihe na-eduzi ihe eji ejikọta ihe eletrọnịkị na bọọdụ sekit. Dịka usoro nrụpụta na arụmọrụ si dị, PCB foil ọla kọpa nwere ike kewaa ụzọ abụọ: foil ọla kọpa akpọrepu (RA) na foil ọla kọpa electrolytic (ED).
A na-eji oghere ọla kọpa dị ọcha mee foil ọla kọpa a na-atụgharị site na mpịakọta na mkpakọ na-aga n'ihu. Ọ nwere elu dị larịị, adịghị ike dị ala na ezigbo ọkụ eletrik, ọ dịkwa mma maka nnyefe mgbaàmà ugboro ugboro. Agbanyeghị, ọnụ ahịa foil ọla kọpa akpọrepu dị elu yana oke oke nwere oke, na-adịkarị n'etiti 9-105 µm.
A na-enweta foil ọla kọpa electrolytic site na nhazi nkwụnye ego electrolytic na efere ọla kọpa. Otu akụkụ dị nro ma otu akụkụ adịghị ike. A na-ejikọta akụkụ ahụ siri ike na mkpụrụ, ebe a na-eji akụkụ dị nro mee ihe maka electroplating ma ọ bụ etching. Uru nke foil ọla kọpa electrolytic bụ ọnụ ala ya na oke ọkpụrụkpụ ya, na-adịkarị n'etiti 5-400 µm. Otú ọ dị, ịdị elu ya dị elu na ọkụ eletrik ya adịghị mma, na-eme ka ọ ghara ịdị mma maka nnyefe mgbaàmà ugboro ugboro.
Nkewa nke PCB foil ọla kọpa
Na mgbakwunye, dị ka roughness nke electrolytic foil ọla kọpa, ọ nwere ike ọzọ kewara n'ime ndị a ụdị:
HTE(Elu okpomọkụ elongation): Elu-okpomọkụ elongation ọla kọpa foil, tumadi eji na multi-layer sekit mbadamba, nwere ezigbo okpomọkụ ductility na bonding ike, na roughness bụ n'ozuzu n'etiti 4-8 µm.
RTF(Reverse Treat Foil): tụgharịa na-emeso foil ọla kọpa, site n'ịgbakwunye otu mkpuchi resin n'akụkụ dị nro nke foil ọla kọpa electrolytic iji melite arụmọrụ nrapado ma belata ike. Ọdịiche dị n'etiti 2-4µm.
ULP( Profaịlụ dị ala dị ala): foil ọla kọpa dị ala dị ala, nke emepụtara site na iji usoro electrolytic pụrụ iche, nwere oke ala dị oke ala ma dabara maka nnyefe mgbama dị elu. Ihe siri ike na-adịkarị n'etiti 1-2 µm.
HVLP(Profaịlụ dị ala dị elu): foil ọla kọpa dị obere ngwa ngwa. Dabere na ULP, a na-arụpụta ya site na ịbawanye ọsọ nke electrolysis. Ọ nwere ala ala roughness na elu mmepụta arụmọrụ. Ọdịiche dị n'etiti 0.5-1 µm. .
Oge nzipu: Mee-24-2024